1+ months

Manufacturing Engineer Die Attach and Wirebond

Cisco Systems Inc.
Carlsbad, CA 92008

What Youll Do:

The manufacturing engineer will be responsible for supporting our die attach and wirebond processes in both wafer and PCB scale assemblies as we continue to scale in our recently expanded clean room. You will take a hands-on and data driven approach to development, debugging, and continuous improvement.

Job duties and responsibilities:

Develop and refine assembly methodologies for process repeatability and robustness.

Setup machine/process recipes for prototype/NPI samples and engineering test builds.

  • Die Attach and Wirebond recipes.
  • Plasma cleaning recipes.
  • Epoxy bake profile recipes.

Qualify in-house pilot assembly lines for production release and support line transfer activities to high volume CM factories.

Create and maintain process documents such as work instructions, engineering specifications, acceptance procedures and control plans.

Evaluate process risk assessments of assembly steps and recommend actions to mitigate.

Implement lean manufacturing practices.

  • Develop standardized work instructions, implement 5S, balance lines, create process flow.
  • Review manufacturing activities and make recommendations to reduce cost, improve setup/cycle times, remove non-value added activities from the manufacturing process.

Address process excursions/issues with a systematic approach to problem solving and statistical analysis.

Drive DOE studies for process optimization and root cause analysis efforts.

Prepare various test/8D/MRB reports and present to the technical team/management for recommended actions.

Who youll work with:

You will be part of the manufacturing engineering team in our Carlsbad facility that supports high volume manufacturing operation of wafer-scale optical chipset assemblies as well as a module level pilot line in our cleanroom. We are a fast pace, dynamic, and hands-on group of engineers responsible for die attach, wirebond, active optical alignment, encap, singulation, and other assembly operations. We work closely with other cross-functional teams such as R&D, Quality, and Production to tackle some of the most difficult manufacturing challenges.

Who you are:

BS or MS in Mechanical, Industrial, or Electrical/Electronics Engineering

10+ years in micro-electronic device assembly and/or opto-electronics manufacturing environment with automated equipment experience such as die attach and/or wirebond is required.

Strong problem-solving skills using 8D method and sound engineering approach to decision making.

Experience leading PFMEA efforts and constructing control plans.

Experience working with various type adhesives and dispense methods such as time/pressure, positive displacement, stamping, and jetting.

Good understanding of GR&R, CpK, correlation, and process control related statistical analysis.

Must be a self-starter to manage projects/tasks from beginning to completion with minimal supervision.

The ability to communicate effectively (verbal and written) across departments.

Working knowledge of statistical software tools such as JMP or equivalent. Strong MS Excel / Macro skills is a plus.

Must be comfortable working in a fast-paced environment.


Posted: 2019-10-11 Expires: 2020-01-01

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Manufacturing Engineer Die Attach and Wirebond

Cisco Systems Inc.
Carlsbad, CA 92008

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